A product you can keep.
A platform you can open.

Warm stone and graphite. A quiet single status light. A removable top without visible face screws. Created from native CAD around the actual Rev G assembly—not an illustrative replacement for the hardware.

No physical unit has been built or tested. Mechanical H has not been sent to JLCPCB and does not modify the frozen Rev G board or its quotation. Enclosure tooling and commercial release remain on hold.

The design change

The enclosure moves from 126 × 84 × 32.4 to 132 × 90 × 33.6 mm (34.8 mm with feet), excluding external cables and antenna connections. The extra perimeter allows 12 mm rounded corners, a more deliberate seam and easier service interfaces. This is a refined enclosure around the existing board, not a miniaturized electronics redesign.

• Two main rigid parts, drafted principal walls, softened crown and 2.4 mm nominal floor/wall. No paint, metal shell or bonded shut assembly.
• Four underside M2.5 closure screws. The lid pillars land on base hard stops; PCB retention is independent. Pilot sizes, screw geometry and torque are candidates pending approval.
• One straight PMMA light pipe at the real D1 location (40,44.5); nominal 0.5 mm air gap. A die-cut applique provides the restrained dark indicator surround. Brightness and light leakage need optical tests.
• Battery stays beside the PCB in Ø18.6 × 70 mm maximum pack bay. Clearance saddles, a separator and removable insulating straps replace an unsecured cell. Strap models represent envelopes, not approved closures.
• Separate field/power boots and USB bezel are replaceable. Internal tie bridges anchor jacketed bundles. Boots are bend guards; their generous prototype bores do not establish pull retention or a seal.
• The optional 156 × 56 × 2.4 mm bracket attaches independently. Outer ears remain accessible to the installer. It is not a snap-fit dock.
• The two power leads now use bounded Bezier elbows. The original global spline overshot below the exit. Battery H1 routes now use VH-compatible 1.8 mm maximum insulation, separated paths and tangent-continuous 4.465 mm minimum centerline bends; wire suitability still requires supplier approval. Other wire paths remain inherited proposals.

Interfaces and assembly

1. Inspect/deburr the empty lower shell; qualify fastener coupons before using the full housing.
2. Install the PCB on unchanged [12,43], [94,11], [12,73], [94,73] mm housing coordinates; PCB bottom/top Z6.4/8.0.
3. Fit RF bulkheads, connector harnesses and cable-entry inserts. Tie sleeved/jacketed field and power bundles to the molded bridges with slack at the PCB plugs. Do not use the contacts as strain relief.
4. Install the qualified protected battery and insulating removable straps; verify clearance with the actual pack, protection circuit, cable exit, NTC and ID leads.
5. Insert the optical pipe from the underside of the lid into its bottom-open counterbore. Approve retention and adhesive compatibility; the applique does not act as a structural pipe retainer.
6. Close the lid vertically and fasten from below. The 0.3 mm perimeter seam is unsealed. USB remains accessible; reset/boot buttons and SIM service require opening the lid.
7. If installing the bracket, first fasten it from beneath using the two separate M3 interfaces, then use its exposed ears to fasten to the mounting surface. Screws and substrate anchors need selection.

USB acceptance gauge: a 14 × 7.5 mm overmold through the opening, with a 28 mm insertion envelope. Supplier plug length and actual metal engagement are not established by that test. Antennas remain external; no internal antenna or new LED array is implied.

Prototype fabrication

STEP and FCStd use millimetres and assembled coordinates. Each STL is translated vertically so its lowest point is Z0 while retaining X/Y and orientation. Do not independently rescale or auto-centre parts for assembly. The upper-shell STL includes long underside pillars; rotate/support it deliberately in the slicer. PA12 additive prototypes are preferred for fit review; ASA/PETG FDM is suitable for early coupons, with its own tolerance compensation. Optical, elastomer, foot and strap meshes require their specified materials; do not print all parts in one rigid resin and assume equivalent function. Source generators require the parent tracker project plus installed FreeCAD/Blender.

Cost and manufacture at 1,000 units

The two rigid shells total 82.80 cm³, versus 80.07 cm³ previously: 3.4% more CAD polymer volume. At an assumed 1.12 g/cm³ density this is approximately 92.7 g, excluding all hardware, inserts and electronics. This is a geometry-based mass estimate, not a material certificate or measured weight.

Cost controls: only two main rigid shells; molded-in colors; die-cut decoration and feet; external antennas retained; no electronics tooling respin; optional mounting plate sold separately. The same shell design accepts either selected color without new geometry. Printed elastomers and an optical prototype precede any dedicated soft-part tooling. Obtain additive and molded quotes before committing tooling at 1,000 units.

No new supplier quote has been obtained. Every $1,000 of tooling adds $1 per device at a 1,000-unit run. Enter supplier figures below; nothing is prefilled as an alleged quotation. Freight, tax, scrap, packaging and warranty are excluded.

Enter supplier costs to calculate.

Local checks actually run

25 geometry gates + 16 independent export gates passed; zero failed. New mechanical solids were compared against all original component, plug and wire solids: 2,688 pairs. Also checked: 91 new-part pairs; pack growth up to +0.5 mm diameter/length; eight shell registration cases; four intermediate cap lifts; a USB insertion gauge; actual LED air gap; revised power and battery paths, their mutual separation and battery bend-radius bounds. Registration samples ±0.2 mm XY and 0/+0.2 mm above the hard stop; it is not a statistical tolerance analysis.

All native assembly solids are valid. Every manufactured-part STEP/STL round trip is valid, STL-closed, within 1% volume of STEP and based at Z0 for printing. The PCB hash is unchanged. The source check logs record early failures and subsequent fixes. Browser meshes are approximations; STEP is the reference. No structural FEA, mold-flow analysis, optical simulation or new enclosed thermal/RF qualification has been performed.

Native check details · Export checks · Unquoted mechanical BOM

What still blocks a commercial release

• Supplier engineering: approve exact pack, USB cable, bulkhead, harness jacket, closure strap, insert and fastener drawings; retention features and tolerances need to match those purchased parts.
• Mold DFM: principal shell draft is modeled, but individual boss/rib/pilot draft, fillets, core-pin strength, thick junctions, shrinkage, gate/ejector positions and shutoffs are not tooling-released. A detailed molder review can require CAD changes. In particular the deep closure pilots and short strap bridges need review.
• Physical mechanical tests: first-article fit, connector engagement, insert retention, lid flushness, screw strip/torque window, repeated service, mounting pull, cable pull/bend, battery retention, vibration and drop. Begin with dummy mass for early fit/drop development; the qualified pack is a separate validation step.
• Physical electrical/thermal/RF: charging and 2 A radio bursts in the final enclosure, cell and touch temperatures, LED visibility, GNSS sensitivity and antenna detuning, ESD/EMC. The old lumped thermal model is not a validation of this housing.
• Finish and user acceptance: color/texture samples, abrasion, cleaning resistance, labeling, feet adhesion, installation instructions and packaging trials. No water/dust ingress rating; an IP-rated variant would require a different sealing design and testing.

Guidance used for DFM review: keep wall transitions controlled and have the molder review draft and localized thickness; see Protolabs wall-thickness guidance and Protolabs molding design essentials. These references inform the review, not a certification of this design.